Induced delamination of silicon-molding compound interfaces

2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Volumn , Issue , 2009, Pages

  Schlottig, Gerd ^a,b,c   Pape, Heinz ^a   Wunderle, Bernhard ^b   Ernst, Leo J ^c  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN PROBLEMS; ELECTRONIC PACKAGING; EPOXY MOLDING COMPOUNDS; EXISTING METHOD; EXPERIMENTAL PROCEDURE; FINITE ELEMENT SIMULATIONS; INTERFACE FRACTURE; MECHANICS PROPERTY; MOLDING COMPOUND; PACKAGE FABRICATION; SILICON INTERFACE;

ELECTRONICS PACKAGING; FRACTURE MECHANICS; METALLIC MATRIX COMPOSITES; MICROELECTRONICS; MICROSYSTEMS; MOLDING; SHEET MOLDING COMPOUNDS; SILICON COMPOUNDS; STEEL SHEET; STRENGTH OF MATERIALS;

FRACTURE;

EID: 67650511916     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2009.4938478     Document Type: Conference Paper

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