Trends of power electronic packaging and modeling

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 1-11

  Liu, Yong ^a   Irving, Scott ^a   Luk, Timwah ^a   Kinzer, Dan ^a  

^a FAIRCHILD SEMICONDUCTOR   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY PROCESS; OVERALL COSTS; PACKAGE DESIGNS; POWER DEVICES; POWER ELECTRONIC PACKAGING; POWER PACKAGES; POWER PACKAGING; POWER SEMICONDUCTOR PACKAGING; POWER SEMICONDUCTORS;

ELECTRIC CONDUCTIVITY; ELECTRIC EQUIPMENT; ELECTRONIC EQUIPMENT MANUFACTURE; POWER ELECTRONICS; SEMICONDUCTOR MATERIALS;

CHIP SCALE PACKAGES;

EID: 63049134289     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763404     Document Type: Conference Paper

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