Improved reliability of leadfree flip chip assemblies using direct underfilling by transfer molding

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2006, Pages 27-34

  Braun, T ^a   Wunderle, B ^a   Becker, K F ^a   Koch, M ^a   Bader, V ^a   Aschenbrenner, R ^a   Reichl, H ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE VEHICLES; ARSENIC COMPOUNDS; ATMOSPHERIC HUMIDITY; AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; BRAZING; CHIP SCALE PACKAGES; CHLORINE COMPOUNDS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; ENCAPSULATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FORMING; LEAD; MECHANISMS; MICROELECTRONICS; MOISTURE; MOLDING; PAINTING; QUALITY ASSURANCE; RELIABILITY; SENSITIVITY ANALYSIS; SHEET MOLDING COMPOUNDS; SILICONES; SOLDERING ALLOYS; STANDARDS; STRESS CONCENTRATION; STRESSES; TECHNOLOGY; TECHNOLOGY TRANSFER; TESTING; THERMOMECHANICAL TREATMENT; TRANSFER MOLDING; VEHICLES; WELDING;

ADVANCED MATERIALS; APPLICATION RANGE; ARRAY PACKAGES; CELLULAR PHONES; COFFIN-MANSON; CONSUMER APPLICATIONS; CREEP STRAINS; DESTRUCTIVE ANALYSIS; ELECTRICAL FAILURES; ELECTRONICS MANUFACTURING; EPOXY MOLDING COMPOUNDS; FAILURE CRITERION; FAILURE MECHANISMS; FINITE ELEMENT MODEL; FLIP CHIP TECHNOLOGIES; FLIP CHIPPING; FLIP-CHIP ASSEMBLIES; FR-4 SUBSTRATE; FRAUNHOFER; HARSH ENVIRONMENTS; HIGH TEMPERATURE; HIGH-RELIABILITY; INTERNATIONAL CONFERENCES; LEAD-FREE; LOW CTE; MATERIAL DATA; MECHANICAL SIMULATIONS; MOBILE PRODUCTS; MOISTURE SENSITIVITY; MOLDING COMPOUND; PROCESS DEVELOPMENTS; PROCESS EVALUATION; RELATIVE HUMIDITIES; RELIABILITY INVESTIGATIONS; RELIABILITY POTENTIAL; RELIABILITY TESTING; SN-AG-CU SOLDER; SOLDER BUMPING; SOLDER FATIGUE; STRESS DISTRIBUTIONS; TEMPERATURE CYCLING; TEMPERATURE LIMITS; TEST VEHICLES; UNDERFILL; UNDERFILL DISPENSING; UNDERFILLING;

FLIP CHIP DEVICES;

EID: 50249111476     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2006.4456427     Document Type: Conference Paper

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