Cure shrinkage and bulk modulus determination for moulding compounds

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 782-787

  Saraswat, M K ^a   Jansen, K M B ^a   Ernst, L J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS INDUSTRY; SHEET MOLDING COMPOUNDS;

BULK MODULUS DETERMINATION; THERMOSET SYSTEMS;

THERMOSETS;

EID: 42549126325     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280100     Document Type: Conference Paper

References (5)

1. Yang D, Jansen K.M.B., Wang L.G., Ernst L.J., "Micromechanical modeling of stress evaluation induced during cure in a Particle Filled Electronic Packaging Polymer ". IEEE Tran. On Components and Packaging Technologies, 4, Vol27, pp 676-683
2. Kamal R., Sourour S., "Kinetics and thermal characterization of thermoset cure", Polymer Engineering Science., vol. 13, 59 (1973).
3. Jansen, K.M.B., "Innovative Thermo-Mechanical prediction and optimization methods for virtual prototyping of miniaturized electronic packages and assemblies", Mevipro Report D38, April 2005.
4. Menard, K.P., Dynamic Mechanical Analysis, CRC Press, 1999.
5. nd ed.; in Turi, E.A., Academic Press: New York, 1998; Vol. 2.