Determination of copper/EMC interface fracture toughness during manufacturing, moisture preconditioning and solder reflow process of semiconductor packages

12th International Conference on Fracture 2009, ICF-12

Volumn 3, Issue , 2009, Pages 1641-1650

  Shirangi, M H ^a   Muller W H ^b   Michel, B ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BI-LAYER; COPPER-BASED; CRITICAL FORCE; EPOXY MOLDING COMPOUNDS; FAILURE MECHANISM; FRACTURE TEST; HIGH TEMPERATURE; HUMID CONDITIONS; HYGROSCOPIC SWELLING; INTERFACE FRACTURE TOUGHNESS; INTERFACIAL ADHESIONS; INTERFACIAL FRACTURE TOUGHNESS; LEAD-FRAME; MICROELECTRONIC PACKAGE; MOIST ENVIRONMENT; MOISTURE DIFFUSION; MOISTURE PRECONDITIONING; MULTI-LAYERED STRUCTURE; POLYMERIC ADHESIVE; SATURATION CONDITIONS; SEMICONDUCTOR PACKAGES; SOLDER REFLOW; THERMAL RESIDUAL STRESS;

ADHESION; COPPER; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FRACTURE; FRACTURE TESTING; FRACTURE TOUGHNESS; MECHANICAL PROPERTIES; MICROELECTRONICS; MOISTURE;

MOISTURE DETERMINATION;

EID: 84869848188     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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