Interface characterization and failure modeling for Semiconductor packages

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 808-815

  Ernst, L J ^a   Xiao, A ^a   Wunderle, B ^b   Jansen, K M B ^a   Pape, H ^c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b FRAUNHOFER IZM   (Germany)

^c INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CANTILEVER BEAMS; CHARGE COUPLED DEVICES; CRACKS; DELAMINATION; FRACTURE; FRACTURE MECHANICS; LEAD COMPOUNDS; LOADING; MATERIALS PROPERTIES; MECHANICAL PROPERTIES; MOISTURE; STEEL SHEET; STRENGTH OF MATERIALS;

CLIMATE CHAMBERS; COPPER LEAD FRAMES; CRACK LENGTHS; DOUBLE CANTILEVER BEAMS; END NOTCHED FLEXURES; EPOXY MOLDING COMPOUNDS; FINITE-ELEMENT MODELING; FRACTURE PROPERTIES; INPUT PARAMETERS; INTERFACE CHARACTERIZATIONS; INTERFACE DELAMINATIONS; INTERFACIAL DELAMINATIONS; INTERFACIAL TOUGHNESS; LAMINATE STRUCTURES; MATERIAL PROPERTIES; MEASUREMENT RESULTS; MICROELECTRONIC INDUSTRIES; MIXED-MODE CONDITIONS; MODE II; MOISTURE CONDITIONS; PRODUCTION PROCESS; SEMICONDUCTOR PACKAGES; SINGLE SPECIMENS; SPECIMEN DIMENSIONS; TEST SETS; TEST SETUPS; TEST SPECIMENS;

ELECTRONICS PACKAGING;

EID: 63049097265     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763531     Document Type: Conference Paper

References (12)

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