Wafer-Level 3D System Integration

Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits

Volumn 2, Issue , 2008, Pages 289-318

  Ramm, Peter ^a   Wolf, M Jürgen ^b   Wunderle, Bernhard ^b  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

ICV SLID technology; Reliability; Solid liquid interdiffusion (SLID); Thin chip integration; Through silicon via (TSV); Vertical system integration

Indexed keywords

EID: 84891333585     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9783527623051.ch16     Document Type: Chapter

References (39)

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