Experimental evaluations of the strength of silicon die by 3-point-bend versus ball-on-ring tests

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 687-694

  Zhao, Jie Hua ^a   Tellkamp, John ^a   Gupta, Vikas ^a   Edwards, Darvin ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

3 point bend; Ball on ring; Die strength; Probabilistic mechanics; Silicon; Weibull distribution

Indexed keywords

BENDING (DEFORMATION); BENDING TESTS; COMPUTER NETWORKS; DEFECTS; DIES; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FORMING; GRINDING (MACHINING); LEAD ALLOYS; OPTIMIZATION; POWDERS; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR MATERIALS; SILICON; SINGLE CRYSTALS; SPEED; SURFACE DEFECTS; TESTING; THERMOMECHANICAL TREATMENT;

3-POINT-BEND; BALL-ON-RING; DIE STRENGTH; PROBABILISTIC MECHANICS; WEIBULL DISTRIBUTION;

SILICON WAFERS;

EID: 50949100114     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544335     Document Type: Conference Paper

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