Lifetime prediction of SnPb and SnAgCu solder joints of chips on copper substrate based on crack propagation FE-analysis

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Deplanque S ^a   Nuchter W ^a   Wunderle, B ^b   Schacht, R ^b   Michel, B ^b  

^a ROBERT BOSCH GMBH   (Germany)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; SOLDERED JOINTS; TIN ALLOYS; TRANSISTORS;

COPPER SUBSTRATE SOLDER JOINTS; POWER TRANSISTORS; SCANNING ACOUSTIC MICROSCOPE (SAM); SOLDER JOINT THICKNESS;

MICROPROCESSOR CHIPS;

EID: 33847121320     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1643976     Document Type: Conference Paper

References (10)

1. H. Reichl. Halbleiterbauelemente, Vorlesung Skriptung. TU Berlin Fachbereich Elektrotechnik, October 1999.
2. M. Burns. Reliability testing and product qualification. Proc. European Power Electronics Conference (EPE), Toulouse, September 2-4 2003.
3. S. Déplanque, W. Nüchter, B. Wunderle, H. Walter, and B. Michel. Evaluation of the primary and secondary creep of snpb solder joint using a modified grooved-lap test specimen. Proc. Eurosime, May 2004.
4. S. Déplanque, W. Nüchter, M. Spraul, B. Wunderle, R. Dudek, and B. Michel. Relevance of primary creep in thermo-mechanical cycling for life-time prediction in sn-based solders. Proc. Eurosime, April 2005.
5. R. Darveaux. Effect of simulation methodology on solder joint crack growth correlation, conference ECTC, proceedings, 2000.
6. R. Darveaux. Solder joint fatigue life model, design and reliability of solders and solder interconnections, Orlando, Florida, USA, pages 213-218, 1997.
7. L.F. Coffin. A Study of the Effects of Cyclic Thermal Stresses on a Ductile Material. Trans. ASME, 76:931-950, 1954.
8. Paul C Paris and F Erdogan. A critical analysis of crack propagation laws. Selected papers on foundations of linear elastic fracture mechanics (A99-25742 06-39), 1963.
9. R. J. Freund and W. J. Wilson. Regression analysis: Statical Modelling of a response variable. Academic press, ISBN 0122674758, 1 edition, 1998.
10. Bernhard Wunderle, Karl-Friedrich Becker, Olaf Wittier, Ralph Schacht, Hans Walter, Mathias Nowottnick, Bernd Michel, and Herbert Reichl. Thermo-mechanical reliability of chip-on-board assemblies with encapsulation in experiment and simulation. Proc. Electronic Components and Technology Conference, San Diego, USA, June 2006.