Reliability aspects of electronics packaging technology using anisotropic conductive adhesives

Journal of Shanghai University

Volumn 11, Issue 1, 2007, Pages 1-16

  Liu, Johan ^a,b   Lu, Xiu Zhen ^a   Cao, Li Qiang ^b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Anisotropic conductive adhesives; Electronics packaging; Reliability

Indexed keywords

EID: 34547361181     PISSN: 10076417     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11741-007-0101-6     Document Type: Article

References (27)

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