Wire flexure fatigue model for asymmetric bond height

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 769-776

  Meyyappan, Karumbu Nathan ^a   Hansen, Peter ^b   McCluskey, Patrick ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b Grundfos DK AS   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTRIC LOADS; FATIGUE OF MATERIALS; MATHEMATICAL MODELS; POWER CONTROL; THERMAL CYCLING; ELECTRONICS PACKAGING; FATIGUE DAMAGE;

FLEXURAL FATIGUE; LOAD TRANSFORMATION; ACCELERATED TESTS; CYCLIC STRAIN; DAMAGE MODEL; DESIGN GUIDELINES; DIFFERENT HEIGHTS; ELASTIC-PLASTIC FATIGUE; FAILURE MECHANISM; FATIGUE MODEL; FLEXURAL FAILURE; LIFE PREDICTION MODELS; PHYSICS-OF-FAILURE; POWER MODULE; STRAIN CYCLES; TEMPERATURE CYCLING; TEMPERATURE CYCLING TESTS; TRANSFORMATION MODEL; WIRE FLEXURE;

ELECTRIC WIRE; WIRE;

EID: 1242287095     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35136     Document Type: Conference Paper

References (7)

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6. Deyhim, A., Yost, B., Lii, M. J., and Li, C. Y., 1991, "Characterization of the fatigue properties of bonding wires", Electronic Components and Technology Conference, pp 836-841.
7. Suresh, S., 1998, "Fatigue of Materials", Cambridge University Press, Second Edition.