Investigation of moisture diffusion in electronic packages by molecular dynamics simulation

Journal of Adhesion Science and Technology

Volumn 20, Issue 16, 2006, Pages 1937-1947

  Fan, Hai Bo ^a   Chan, Edward K L ^a   Wong, Cell K Y ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Interfacial delamination; Moisture diffusion; Molecular dynamics simulation

Indexed keywords

COMPUTER SIMULATION; DELAMINATION; DIFFUSION; INTEGRATED CIRCUITS; MOLECULAR DYNAMICS; WETTING; MOLECULAR MECHANICS;

INTERFACIAL DELAMINATION; MEAN-SQUARED DISPLACEMENTS; MOISTURE DIFFUSION;

ELECTRONICS PACKAGING; MOISTURE;

DOMINANT MECHANISM; ELECTRONIC ASSEMBLIES; ELECTRONIC PACKAGE; EPOXY MOLDING COMPOUNDS; INTEGRATED CIRCUIT PACKAGE; INTERFACIAL DELAMINATION; MD SIMULATION; MEAN SQUARED DISPLACEMENT; MOISTURE DIFFUSION; MOISTURE DIFFUSION COEFFICIENT; MOLECULAR DYNAMICS SIMULATION; MOLECULAR DYNAMICS SIMULATIONS; MOLECULAR LEVELS; MULTI-LAYERED; PLASTIC PACKAGES;

EID: 33846207119     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856106779116588     Document Type: Article

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