Optimization of electronics assemblies towards robust design under fracture, delamination and fatigue aspects

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages

  Auersperg, Juergen ^a,b   Klein, Matthias ^a   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

^b AMIC Angewandte Micro Messtechnik GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; DELAMINATION; ELECTRONICS PACKAGING; ESTIMATION; FRACTURE FIXATION; FRACTURE MECHANICS; HIGH TEMPERATURE APPLICATIONS; INDUSTRIAL ENGINEERING; OPTIMIZATION; PHASE INTERFACES; PHOTONICS; PROCESS ENGINEERING; PRODUCT DEVELOPMENT; PROJECT MANAGEMENT; SPEED; STEEL SHEET; STRENGTH OF MATERIALS; STRESSES; TECHNOLOGY; THERMAL SPRAYING; WELDING;

COFFIN-MANSON; DESIGN STUDIES; ELECTRONIC COMPONENTS; ELECTRONIC PACKAGING; ELECTRONICS COMPONENTS; ENVIRONMENTAL CONDITIONING; FATIGUE ESTIMATION; HIGH TEMPERATURE; IN-HOMOGENEITY; INTERFACE DELAMINATION; INTERNATIONAL CONFERENCES; MANUFACTURING PROCESSES; MECHANICAL SHOCKS; MISMATCH PROBLEMS; MIXED-MODE INTERFACE; PARAMETERIZED; POWER APPLICATIONS; PRODUCT DEVELOPMENT PROCESS; ROBUST DESIGNS; SOLDER INTERCONNECTS; SOLDER JOINTS; STRESS/STRAIN;

THERMAL EXPANSION;

EID: 50249106280     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2007.4441403     Document Type: Conference Paper

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