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1
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2
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33747805723
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Reichl H, Michel B, Schubert A. Materials Science and Engineering-A MajorTopic in the Future of Micro-electronic Packaging. Proc. 3. Int. Conf. Micromaterials, April 17-19, 2000, p. 72-73.
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4
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4444376660
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Wunderle B, Schacht R, Wittler O, Michel B, Reichl H. Perfromance and thermo-mechanical reliability of micro-channel coolers-a parametric study. Itherm Conference, Las Vegas, USA, June 1-4: 11-16, 2004.
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6
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33747787805
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Michel B, Wunderle B. Simulation and Reliability on the way from micro to nano. Ansys users meeting 21st Cadfem Users Conference, 12-14. Nov 2003 Potsdam, Germany.
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10
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0038689228
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Schubert† A, Dudek R, Auerswald E, Gollhardt A, Michel B, Reichl H. Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation. 53rd Electronic Components and Technology Conference, New Orleans, USA, May 27-30: 2003, p. 603-610.
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11
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33747803409
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Micro Materials Centre Berlin at the Fraunhofer Institute IZM, Germany p. 12-25
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Schubert A., Dudek R., Walter H., Jung E., Gollhardt A., and Michel B. Lead-free Flip-Chip Solder Interconnects-Materials Mechanics and Reliability Issues. 1st ed. Micromaterials and Nanomaterials (2002), Micro Materials Centre Berlin at the Fraunhofer Institute IZM, Germany p. 12-25
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12
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Auersperg J, Kieselstein E, Schubert A, Michel B. Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches, Symp. On Reliability, Stress Analysis, and Failure Prevention of the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, proc, vol. 2, IMECE2001/DE-25109.
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13
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Wittler O. Bruchmechanische Analyse von viskoelastischen Werkstoffen in elektronischen Bauteilen. PhD-Thesis, TU-Berlin, 2004.
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Frear D., Morgan H., Burchett S., and Lau J. The Mechanics of Solder Alloy Interconnects (1994), Van Nostrand Reinhold, New York
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Frear, D.1
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10444231944
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Wunderle B, Dudek R, Michel B, Reichl H. Thermo-Mechanical Reliability of Power Flip-Chip Cooling Concepts. 54th Electronic Components and Technology Conference, Las Vegas, USA, June 1-4: 2004, p. 427-36.
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16
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6344235460
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Parametric FE-approach to flip-chip reliability under various loading conditions
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Wunderle B., Nüchter W., Schubert A., Michel B., and Reichl H. Parametric FE-approach to flip-chip reliability under various loading conditions. Journal of Microelectronics Reliability, Elsevier (2004) 1933-1945
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17
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Spraul M, Nüchter W, Möller A, Wunderle B, Michel B. Reliability of SnPb and Pb-Free Flip-Chips Under Different Test Conditions. Proc. 4th EuroSimE Conf., Brussels, Belgium, May 10-12, 2004, p. 437-42.
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20
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Incremental path-independent integrals in inelastic and dynamic fracture mechanics
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Atluri S.N., Nishioka T., and Nishioka M. Incremental path-independent integrals in inelastic and dynamic fracture mechanics. Engineering Fracture Mechanics 20 2 (1983) 209-244
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On the energy release rate and the jintegral for 3d crack con.gurations
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de Lorenzi H.G. On the energy release rate and the jintegral for 3d crack con.gurations. Int. Journal of Fracture 19 (1982) 183-193
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de Lorenzi, H.G.1
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33747761730
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Vogel D, Gollhardt A, Schubert A, Kühnert R, Michel B. MicroDAC strain Measurement for FEA-Support. Proc. 3rd MicroMat Conf., Berlin, Germany, 2000, p. 311-14.
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23
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Wunderle B, Auersperg J, Grosser V, Kaulfersch E, Wittler O, Michel B. Modular Parametric Finite Element Modelling for Reliability-Studies in Electronic and Mems Packaging. Proc. of Symposium on Design,Test, Integration and Packaging of MEMS/MOEMS, May 5-7, Cannes, France, 2003, p. 335-40.
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24
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0034821489
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Wiese S, Schubert A, Walter H, Dudek R, Feustel F, Meusel E, et al. Constitutive Behaviour of Lead-Free vs. Lead-Containing Solders-Experiments on Bulk Specimens and Flip-Chip Joints. IEEE Proc. Electronic Components and Technology Conference, 2001, p. 890-902.
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25
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Déplanque S, Nüchter W, Wunderle B, Walter H, Michel B. Evaluation of the Primary and Secondary Creep of SnPb solder joint using a modified grooved-lap test specimen Proc. 4th EuroSimE Conf., Brussels, Belgium, May 10-12, 2004, p. 451-58.
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28
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Ernst LJ. Polymer Material Characterisation and Modeling. Proc. 1st EuroSimE Conf., Eindhoven, NL, 2000, p. 37-58.
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Walter H, Schneider W, Dudek R, Auerswald E, Schubert A. Evaluation of Glob Top Materials for Chip-on-Board COB Applications. Proc. 3. Int. Conf. on Micro Materials, April 17-19 2000. Berlin, Germany, p. 1269-71.
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30
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Dudek R, Walter H, Zapf J, Michel B. Investigations on Low Cycle Fatigue of Electrodeposited thin Copper and Nickel films. Eurosime, Aix-en-Provence, France, 2003.
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32
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54049083120
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Vogel D, Michel B. Microcrack Evaluation for Electronics Components by AFM nanoDAC Deformation Measurement. Proc. of IEEE-NANO 2001, Oct. 28-30, 2001, Maui, Hawaii, p. 309-12.
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33
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Displacement and strain field measurements from SPM images
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Bhushan B., Fuchs H., and Hosaka S. (Eds), Springer
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Keller J., Vogel D., Schubert A., and Michel B. Displacement and strain field measurements from SPM images. In: Bhushan B., Fuchs H., and Hosaka S. (Eds). Applied Scanning Probe Methods (2003), Springer
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Applied Scanning Probe Methods
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Direct numerical predictions for the elastic and thermoelastic properties of short fibre composites
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Lusti H.R., Hine P.J., and Gusev A.A. Direct numerical predictions for the elastic and thermoelastic properties of short fibre composites. Composites Science and Technology 62 (2002) 1927-1934
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Wunderle B, Dermitzaki E, Keller J, Vogel D, Michel B. Mechanical Characterisation of Micro/ Nano-filled Polymers by a Combined Experimental and Simulative Procedure. Proc. 4th IEEE Conf. On Nanotechnology, Munich, Germany, August 16-19, 2004.
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FE-Simulations for Polymeric Packaging Materials
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