Accelerated thermal cycling guidelines for electronic packages in military avionics thermal environment

Journal of Electronic Packaging

Volumn 126, Issue 2, 2004, Pages 256-264

  Pucha, Raghuram V ^a   Tunga, Krishna ^a   Pyland, James ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROELECTRONICS; MILITARY APPLICATIONS; MILITARY AVIATION; OBSOLESCENCE; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; TELECOMMUNICATION SYSTEMS; THERMAL CYCLING;

LIFETIME; MILITARY AVIONICS; NON-OPERATING CONDITIONS; POWER CYCLE CONDITIONS;

ELECTRONICS PACKAGING;

EID: 12344322625     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1756150     Document Type: Article

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