Viscoelastic properties of an epoxy resin during cure

Journal of Composite Materials

Volumn 35, Issue 10, 2001, Pages 883-904

  O'Brien, Daniel J ^a   Mather, Patrick T ^b   White, Scott R ^c  

^a University of Illinois at Urbana Champaign   (United States)

^b UNIVERSITY OF CONNECTICUT   (United States)

^c UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; INTERPENETRATING POLYMER NETWORKS; RHEOMETERS; STRESS RELAXATION; VISCOELASTICITY;

EPOXY NETWORK; GEL POINT; PARALLEL PLATE RHEOMETRY; RELAXATION MODULUS;

EPOXY RESINS;

EID: 0034945032     PISSN: 00219983     EISSN: None     Source Type: Journal    
DOI: 10.1106/HLYM-5CM7-BP9N-L1Y1     Document Type: Article

References (24)

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