Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography

14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008

Volumn , Issue , 2008, Pages 47-51

  May, D ^a   Wunderle, B ^a   Ras, M Abo ^a   Faust, W ^a   Gollhard, A ^c   Schacht, R ^a,b   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

^b Lausitz University of Applied Sciences   (Germany)

^c AMIC Angewandte Micro Messtechnik GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTIC METHODS; CRACK GROWTHS; ELECTRICAL EXCITATIONS; IR THERMOGRAPHIES; LARGESCALE; MATERIAL CHARACTERIZATIONS; MATERIAL PROPERTIES; MICROELECTRONIC DEVICES; NEW CONCEPTS; OHMIC TESTS; ON CHIPS; PULSE EXCITATIONS; TRANSIENT PULSES;

CRACK TIPS; CRACKING (CHEMICAL); CRACKS; FAILURE ANALYSIS; NONDESTRUCTIVE EXAMINATION; OHMIC CONTACTS; PULSE GENERATORS; PULSED LASER APPLICATIONS; QUALITY ASSURANCE; REMOTE SENSING; SAFETY FACTOR; TECHNICAL PRESENTATIONS; THERMOGRAPHY (IMAGING); THERMOGRAPHY (TEMPERATURE MEASUREMENT);

LASER EXCITATION;

EID: 57649208445     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2008.4669877     Document Type: Conference Paper

References (5)

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2. J. Rantala2, D. Wul, A. Salernol, G. Bussel - Lock-in thermography with mechanical loss angle heating at ultrasonic frequencies
3. Breitenstein O. Langenkamp M. Lock-in Thermography - Basics and use for Functional Diagnostics of Electronic Components, Springer-verlag berlin, Heidelberg 2003, ISBN 3-540-43439-9
4. Thomson, W. (Lord Kelvin): On the dynamical theory of heat. Trans. Roy. Soc. Edinburgh, 20(1853), 261-283.
5. Miiller, L.; ThermoStrain-Entwicklung eines neuen Verfahrens zur Dehnungsanalyse beanspruchter Stahlbauteile; Der Andere Verlag 2005; ISBN-13: 978-3899593433