Thermal fatigue life evaluation of aluminum wire bonds

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 726-731

  Matsunaga, Toshihiro ^a   Uegai, Yasumi ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTRIC CURRENTS; SEMICONDUCTOR JUNCTIONS; THERMAL CYCLING; THERMAL FATIGUE;

ALUMINUM WIRE BONDS; POWER CYCLING; SEMICONDUCTOR POWER MODULE;

WIRE;

EID: 42549091002     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280092     Document Type: Conference Paper

References (6)

1. P. Cova and F. Fantini, "On the effect of power cycling stress on IGBT modules", Microelectronics Reliability 38, (1998), pp.1347-1352.
2. T. Matsunaga and Y. Uegai, "Effect of Temperature Range on Thermal Fatigue Life of Aluminum Wire Bond in Power Modules" Symposium on Microjoining and Assembly Techniqus in Electronics",(Japan Welding Society, 2004), pp. 193-196.
3. F. Lecoq, D. Lhotellier, V. de Viry, and Ph. Dupu, "Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter", Microelectronics Reliability 41, (2001), pp.1695- 1700.
4. M. Held, P. Jacob, G. Nicoletti, P. Scacco, and M. H. Poech,"Fast power cycling test for insulated gate bipolar transistor modules in traction application" INT. J. ELECTRONICS Vol.86, (1999), pp.1193-1204.
5. The Japan Society of Mechanical Engineers, Fatigue of Metals, I , (Japan 1982), pp.5-6.
6. H. Nishitani, et al, Fatigue strength, (Japan 1985), pp 231-233.