Thermo-mechanical reliability of power flip-chip cooling concepts

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 427-436

  Wunderle, B ^a   Dudek, R ^a   Michel, B ^a   Reichl, H ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONICS INDUSTRY; HEAT SINKS; RELIABILITY; THERMAL LOAD; THERMOMECHANICAL TREATMENT;

FLIP-CHIP ASSEMBLY; POWER DENSITY; SOLDER BUMPS; THERMAL RELIABILITY;

FLIP CHIP DEVICES;

EID: 10444231944     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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