RF PA module substrate via reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1181-1189

  Darveaux, Robert ^a   Yang, Jicheng ^a   Sheridan, Richard ^a   Buella, Boy ^b   Villareal, Paul ^b  

^a AMKOR TECHNOLOGY   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; RELIABILITY; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; THICKNESS MEASUREMENT;

CAPPING; MODULE SUBSTRATE; TRACE THICKNESS; WALL THICKNESS;

ELECTRONICS PACKAGING;

EID: 0038012350     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. R. Iannuzzelli, "Predicting Plated-Through-Hole Reliability in High Temperature Manufacturing Processes," Proc ECTC 1991, pp. 410-421.
2. B. Mirman, "Mathematical Model of Plated-Through-Hole Structure Under a Load Induced by Thermal Mismatch," International Thermal Conference, 1988.
3. S. Fauser, C. Ramirex, L. Cartwrigt, "Plated Through Hole Reliability in Printed Curcuit Boards Which Utilize Direct Power / Ground Plane Interconnection," International Journal of Microcircuits and Electronic Packaging, Volume 17, Number 2, Second Quarter 1994, pp. 127-134.
4. B. Ozmat, "A Nonlinear Thermal Stress Analysis of the Plated Through Holes of Printed Wiring Boards," Proc International Electronic Packaging Society Conference, 1990, pp. 359-381.
5. T. Young, F. Polakovic, M. Carano, "Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing," Proc IPC Printed Circuits Expo, 2000, pp. S09-6-1 to S09-6-10.
6. R. Darveaux, L. Norton, and F. Carney, "Temperature Dependent Mechanical Behavior of Plastic Packaging Materials," Proc. ECTC, 1995, pp. 1054-1058.
7. CINDAS Report 88, Purdue University, October 1987.
8. CINDAS Report 105, Purdue University, December 1992.
9. Vendor data sheets.
10. Materials Selector 1988, Materials Engineering, Penton Publishing.
11. W. Engelmaier, "Results of the IPC Copper Foil Ductility Round-Robin Study," IPC Publication No. 947, 1987.