Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing

Electrochimica Acta

Volumn 53, Issue 1, 2007, Pages 145-154

  Moffat, T P ^a   Wheeler, D ^a   Kim, S K ^a   Josell, D ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Damascene and additives; MEMS; ULSI

Indexed keywords

ADSORBATES; ADSORPTION; COMPUTER SIMULATION; DEPOSITION RATES; MEMS;

BUMP CONTROL; CURVATURE ENHANCED ADSORBATE COVERAGE; DAMASCENE PROCESSING; SUPERFILLING;

ELECTRODEPOSITION;

EID: 34548556652     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2007.03.025     Document Type: Article

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