Leveling of superfilled damascene Cu film using two-step electrodeposition

Electrochemical and Solid-State Letters

Volumn 9, Issue 2, 2006, Pages

  Kim, Soo Kil ^a,b   Hwang, Soonsik ^a   Cho, Sung Ki ^a   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CONCENTRATION (PROCESS); COPPER; MODULATION; REACTION KINETICS;

BENZOTRIAZOLE (BTA); BUMP FORMATION; SUPERFILLED DAMASCENE;

ELECTRODEPOSITION;

EID: 30644463169     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2139976     Document Type: Article

References (30)

1. D. Josell, D. Wheeler, and T. P. Moffat, Electrochem. Solid-State Lett., 5, C49 (2002).
2. D. Josell, D. Wheeler, W. H. Huber, J. E. Bonevich, and T. P. Moffat, J. Electrochem. Soc., 148, C767 (2001).
3. D. Josell, D. Wheeler, W. H. Huber, and T. P. Moffat, Phys. Rev. Lett., 87, 016102 (2001).
4. T. P. Moffat, D. Wheeler, W. H. Huber, and D. Josell, Electrochem. Solid-State Lett., 4, C26 (2001).
5. D. Wheeler, D. Josell, and T. P. Moffat, J. Electrochem. Soc., 150, C302 (2003).
6. P. M. Vereecken, R. A. Binstead, H. Deligianni, and P. C. Andricacos, IBM J. Res. Dev., 49, 3 (2005).
7. J. J. Kim, S.-K. Kim, and Y. S. Kim, J. Electroanal. Chem., 542, 61 (2003).
8. S.-K. Kim and J. J. Kim, Electrochem. Solid-State Lett., 7, C98 (2004).
9. A. Frank and A. J. Bard, J. Electrochem. Soc., 150, C244 (2003).
10. T. P. Moffat, B. Baker, D. Wheeler, and D. Josell, Electrochem. Solid-State Lett., 6, C59 (2003).
11. P. Singer, Semicond. Int., 27 (5) (2004).
12. Y. H. Im, M. O. Bloomfield, S. Sen, and T. S. Cale Electrochem. Solid-State Lett., 6, C42 (2003).
13. J. Reid, E. Webb, J. Sukamto, Y. Takada, and T. Archer, in Abstract 148, The Electrochemical Society Meeting Abstracts, Vol. 2004-1, San Antonio, TX, May 9-13, 2004.
14. M. X. Yang, D. Mao, C. Yu, J. Dukovic, and M. Xi, Solid State Technol., 46, 37 (2003).
15. S.-C. Chang, J.-M. Shieh, B.-T Dai, M.-S. Feng, Y.-H. Li, C. H. Shih, M. H. Tsai, S. L. Shue, R. S. Liang, and Y.-L. Wang, Electrochem. Solid-State Lett., 6, G72 (2003).
16. T. P. Moffat, D. Wheeler, and D. Josell, J. Electrochem. Soc., 151, C262 (2004).
17. J. P. Healy and D. P. Goodenough, J. Electroanal. Chem., 338, 167 (1992).
18. C.E. Uzoh, H. Talieh, T. Wang, and B.M. Basol, in Abstract 152, The Electrochemical Society Meeting Abstracts, Vol. 2004-1, San Antonio, TX, May 9-13, 2004.
19. G. K. Gomma, Mater. Chem. Phys., 56 27 (1998).
20. J. R. Santos, Jr, L. H. C. Mattoso, and A. J. Motheo, Electrochim. Acta, 43 309 (1998).
21. J. J. Kim, S.-K. Kim, and J.-U. Bae, Thin Solid Films, 415, 101 (2002).
22. K.-C. Lin, J.-M. Shieh, S.-C. Chang, B.-T. Dai, C.-F. Chen, M.-S. Feng, and Y.-H. Li, J. Vac. Sci. Technol. B, 20, 2233 (2002).
23. T. P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. Stafford, and D. Josell, J. Electrochem. Soc., 147, 4524 (2000).
24. A. C. West, S. Mayer, and J. Reid, Electrochem. Solid-State Lett., 4, C50 (2001).
25. D. Josell, B. Baker, C. Witt, D. Wheeler, and T. P. Moffat, J. Electrochem. Soc., 149, C637 (2002).
26. T. P. Moffat, D. Wheeler, C. Witt, and D. Josell, Electrochem. Solid-State Lett., 5, C110 (2002).
27. P. Taephaisitphongse, Y. Cao, and A. C. West, J. Electrochem. Soc., 148 C492 (2001).
28. Y. Ling, Y. Guan, and K. N. Han, Corros. Sci., 51, 367 (1995).
29. R. Youda, H. Nishihara, and K. Aramaki, Corros. Sci., 28, 87 (1988).
30. S.-M. Jang, U.S. Pat. 6,350,364 (2002).