Sub-100nm interconnects using multistep plating

Solid State Technology

Volumn 46, Issue 10, 2003, Pages 37-38+40

  Yang, Michael X ^a   Mao, Daxin ^a   Yu, Chunman ^a   Dukovic, John ^a   Xi, Ming ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; CHEMICAL MECHANICAL POLISHING; CLOSED LOOP CONTROL SYSTEMS; COPPER; CYCLIC VOLTAMMETRY; ELECTROPLATING; PROCESS CONTROL; SEMICONDUCTING FILMS; SOLID ELECTROLYTES; WSI CIRCUITS;

COPPER INTERCONNECTS; CYCLIC VOLTAMETRIC STRIPPING; FILM PLANARIZATION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0142149026     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)