Influence of molecular weight of polyethylene glycol on microvia filling by copper electroplating

Journal of the Electrochemical Society

Volumn 152, Issue 11, 2005, Pages

  Dow, Wei Ping ^a,b   Yen, Ming Yao ^a   Lin, Wen Bing ^a   Ho, Shih Wei ^a  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b ELECTROCHEMICAL SOCIETY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ELECTROPLATING; GALVANOSTATIC MEASUREMENT; MICROVIA FILLING; SURFACE COVERAGE;

ADSORPTION; CATALYSIS; CATHODES; COPPER PLATING; ELECTROCHEMISTRY; ELECTROPLATING; IMAGE ANALYSIS; MICROSCOPES; MOLECULAR WEIGHT; PRECIPITATION (CHEMICAL); SCANNING ELECTRON MICROSCOPY; SURFACE CHEMISTRY;

POLYETHYLENE GLYCOLS;

EID: 27944494863     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2052019     Document Type: Article

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