Interconnect fabrication by superconformal iodine-catalyzed chemical vapor deposition of copper

Journal of the Electrochemical Society

Volumn 150, Issue 5, 2003, Pages

  Josell, D ^a   Kim, Sibum ^b   Wheeler, D ^a   Moffat, T P ^a   Pyo, Sung Gyu ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CATALYSIS; CHEMICAL VAPOR DEPOSITION; CONFORMATIONS; COPPER; FLUORESCENCE; IODINE; MATHEMATICAL MODELS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SURFACE ACTIVE AGENTS; TRANSMISSION ELECTRON MICROSCOPY;

CURVATURE ENHANCED ACCELERATOR COVERAGE; INTERCONNECT FABRICATION; SUPERCONFORMAL FILLING;

ELECTROCHEMISTRY;

EID: 0038516919     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1566960     Document Type: Article

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