Superconformal film growth: Mechanism and quantification

IBM Journal of Research and Development

Volumn 49, Issue 1, 2005, Pages 19-36

  Moffat, Thomas P ^a   Wheeler, Daniel ^a   Edelstein, Monica D ^a   Josell, Daniel ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSTS; COMPUTER SIMULATION; CONFORMATIONS; COPPER; ELECTRODEPOSITION; ELECTRODES; ELECTROLYTES; INTERFACES (MATERIALS); MATHEMATICAL MODELS; REACTION KINETICS;

COPPER DEPOSITION; CURVATURE ENHANCED ACCELERATOR COVERAGE MODEL; PLANAR ELECTRODES; SUPERCONFORMAL FILM GROWTH;

FILM GROWTH;

EID: 13844296716     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.491.0019     Document Type: Article

References (47)

1. P. C. Andricacos, Interface (Electrochem. Soc.) 8, 32 (1999).
2. P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. & Dev. 42, 567 (1998).
3. H. Deligianni, J. O. Dukovic, P. C. Andricacos, and E. G. Walton, in Electrochemical Processing in ULSI Fabrication and Semiconductor/Metal Deposition II, P. C. Andricacos, J. L. Stickney, and G. M. Olezak, Eds., PV 99-9, The Electrochemical Society Proceedings Series, Pennington, NJ, 2000, p. 52.
4. A. C. West, J. Electrochem. Soc. 147, 227 (2000).
5. J. Reid and S. Mayer, in Proceedings of the 1999 Advanced Metallization Conference, M. E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda, Eds., Materials Research Society, Warrendale, PA, 2000, p. 53.
6. T. Ritzdorf, D. Fulton, and L. Chen, in Proceedings of the 1999 Advanced Metallization Conference, M. E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda, Eds., Materials Research Society, Warrendale, PA, 2000, p. 101.
7. E. Richard, I. Vervoort, S. H. Brongersma, H. Bender, G. Beyer, R. Palmans, S. Lagrange, and K. Maex, in Proceedings of the 1999 Advanced Metallization Conference, M. E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda, Eds., Materials Research Society, Warrendale, PA, 2000, p. 149.
8. T. P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. Stafford, and D. Josell, J. Electrochem. Soc. 147, 4524 (2000).
9. P. Taephaisitphongse, Y. Cao, and A. C. West, J. Electrochem. Soc. 148, C492 (2001).
10. T. P. Moffat, D. Wheeler, W. H. Huber, and D. Josell, Electrochem. Solid-State Lett. 4, C26 (2001).
11. D. Josell, D. Wheeler, W. H. Huber, J. E. Bonevich, and T. P. Moffat, J. Electrochem. Soc. 148, C767 (2001).
12. D. Wheeler, D. Josell, and T. P. Moffat, J. Electrochem. Soc. 150, C203 (2003).
13. A. C. West, S. Mayer, and J. Reid, Electrochem. Solid-State Lett. 4, C50 (2001).
14. G. McFadden, S. R. Coriell, T. P. Moffat, D. Josell, D. Wheeler, W. Schwarzacher, and J. Mallett, J. Electrochem. Soc. 150, C591 (2003).
15. B. C. Baker, C. Witt, D. Wheeler, D. Josell, and T. P. Moffat, Electrochem. Solid-State Lett. 6, C67 (2003) and references therein.
16. D. Josell, S. Kim, D. Wheeler, T. P. Moffat, and S. G. Pyo, J. Electrochem. Soc. 150, C368 (2003) and references therein.
17. U. Bertocci, Electrochim. Acta 11, 1261 (1966).
18. A. Molodov, G. N. Markosyan, and V. V. Losev, Electrochim. Acta 17, 701 (1972).
19. U. Bertocci and D. Turner, Encyclopedia of Electrochemistry of the Elements, Vol. 2, A. J. Bard, Ed., Marcel Dekker, New York, 1974, p. 1.
20. M. Yokoi, S. Konishi, and T. Hayashi, Denki Kagaku 51, 310 (1983),
21. S. Krzewska, Electrochim. Acta 42, 3531 (1997).
22. S. Yoon, M. Schwartz, and K. Nobe, Plating & Surface Finishing 81, 65 (December 1994) and references therein.
23. E. Gileadi and V. Tsionsky, J. Electrochem. Soc. 147, 567 (2000).
24. A. Jardy, A. Legal Lasalle-Molin, M. Keddam, and H. Takenouti, Electrochim. Acta 37, 219 (1992).
25. J. J. Kelly and A. C. West, J. Electrochem. Soc. 145, 3477 (1998).
26. M. R. H. Hill and G. T. Rogers, J. Electroanal. Chem. 86, 179 (1978).
27. M. Yokoi, S. Konishi, and T. Hayashi, Denki Kagaku 52, 218 (1984).
28. D. Stoychev and C. Tsvetanov, J. Appl. Electrochem. 26, 741 (1996).
29. J. J. Kelly and A. C. West, J. Electrochem. Soc. 145, 3472 (1998).
30. T. P. Moffat, D. Wheeler, and D. Josell, J. Electrochem. Soc. 151, C262 (2004).
31. M. Kang and A. A. Gewirth, J. Electrochem. Soc. 150, C426 (2003).
32. S. G. Malhotra, P. S. Locke, A. H. Simon, J. Fluegel, P. DeHaven, D. G. Hemmes, R. Jackson, and E. Patton, in Proceedings of the 1999 Advanced Metallization Conference, M. E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda, Eds., Materials Research Society, Warrendale, PA, 2000, p. 77.
33. B. Baker, D. Pena, M. Herrick, R. Chowdhury, E. Acosta, C. R. Simpson, and G. Hamilton, in Electrochemical Processing in ULSI Fabrication and Semiconductor/Metal Deposition II, P. C. Andricacos, P. C. Searson, C. Reidsema-Simpson, P. Allongue, J. L. Stickney, and G. M. Oleszek, Eds., The Electrochemical Society Proceedings Series, Pennington, NJ, 1999.
34. P. C. Andricacos, C. Parks, C. Cabral, R. Wachnik, R. Tsai, S. Malhotra, P. Locke, J. Fluegel, J. Horkans, K. Kwietniak, C. Uzoh, K. P. Rodbell, L. Gignac, E. Walton, D. Chung, and R. Geffken, in Electrochemical Processing in ULSI Fabrication and Semiconductor/Metal Deposition II, P. C. Andricacos, P. C. Searson, C. Reidsema-Simpson, P. Allongue, J. L. Stickney, and M. Oleszek, Eds., The Electrochemical Society Proceedings Series, Pennington, NJ, 1999.
35. O. M. Magnussen, Chem. Rev. 102, 679 (2002).
36. H. A. Biebuyck, C. D. Bain, and G. M. Whitesides, Langmuir 10 1825 (1994).
37. Ch. Jung, O. Dannenberger, Y. Xu, M. Buck, and M. Grunze, Langmuir 14, 1103 (1998).
38. S. Vollmer, P. Fouquet, G. Witte, Ch. Boas, M. Kunat, U. Burghaus, and Ch. Woll, Surf. Sci. 462, 135 (2000).
39. H. Kondoh, N. Saito, F. Matsui, T. Yokoyama, T. Ohta, and H. Kuroda, J. Phys. Chem. B 105, 12870 (2001).
40. S. Driver and D. P. Woodruff, Surf. Sci. 488, 207 (2001).
41. M. J. Esplandiu, H. Hagenstrom, and D. M. Kolb, Langmuir 17, 828 (2001).
42. D. K. Schwartz, Ann. Rev. Phys. Chem. 52, 107 (2001).
43. S. Xu, S. J. N. Cruchon-Dupeyrat, J. C. Garno, G.-Y. Liu, G. K. Jennings, T.-H. Yong, and P. E. Laibinis, J. Chem. Phys. 108 5002 (1998).
44. L. S. Jung and C. T. Campbell, J. Phys. Chem. B 104, 11168 (2000).
45. M. Schweizer, H. Hagenstrom, and D. M. Kolb, Surf. Sci. 490, L627 (2001).
46. T. P. Moffat, D. Wheeler, C. Witt, and D. Josell, Electrochem. Solid-State Lett. 5, C49 (2002).
47. D. Josell, B. Baker, C. Witt, D. Wheeler, and T. P. Moffat, J. Electrochem. Soc. 149, C637 (2002).