Development of 3-component electroplating chemistry and processes to meet gap filling and bath control requirements for 0.1 μm technology node

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 197-202

  Zheng, Bo ^a   He, Renren ^a   Mikkola, Bob ^a   Wang, Jingyan ^a   Long, Chunping ^a   Yu, Chunman ^a   Sun, Zhi Wen ^a   Step, Eugene ^a   Chen, Jay ^a   Emami, Ramin ^a   Alex Wang, Z ^a   Nayak, Radha ^a   Taylor, Tom ^a   Dixit, Girish ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CHEMICAL MECHANICAL POLISHING; COPPER; INTERCONNECTION NETWORKS; METALLIZING; SEMICONDUCTOR DEVICE MANUFACTURE;

COPPER INTERCONNECTS;

ELECTROPLATING;

EID: 0035555182     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)