Modeling pattern density dependent bump formation in copper electrochemical deposition

Electrochemical and Solid-State Letters

Volumn 6, Issue 3, 2003, Pages

  Im, Yeon Ho ^a   Bloomfield, Max O ^a   Sen, Suchira ^a   Cale, Timothy S ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COMPUTER SIMULATION; COPPER; ELECTRODEPOSITION; SCANNING ELECTRON MICROSCOPY;

PATTERN DENSITY;

ELECTROCHEMISTRY;

EID: 0037342040     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1541256     Document Type: Article

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