SCOPUS 정보 검색 플랫폼

Volumn 6, Issue 2, 2003, Pages

Cathodic depolarization effect during Cu electroplating on patterned wafers

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ASPECT RATIO; CURRENT VOLTAGE CHARACTERISTICS; ELECTROLYTES; ELECTROPLATING; POLARIZATION; SILICON WAFERS;

ACCELERATING ORGANIC ADDITIVES; BOTTOM UP FILLING; CATHODIC DEPOLARIZATION EFFECT; CURRENT SUPPRESSING ORGANIC ADDITIVES; TRENCH FILLING;

COPPER PLATING;

EID: 0037323501 PISSN: 10990062 EISSN: None Source Type: Journal
DOI: 10.1149/1.1535754 Document Type: Article

Times cited : (20)

References (10)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.