Mechanically induced superfilling of low-aspect-ratio cavities in an electrochemical mechanical deposition process

Journal of the Electrochemical Society

Volumn 151, Issue 12, 2004, Pages

  Başol, Bülent M ^a  

^a NuTool Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANODES; ASPECT RATIO; COPPER; ELECTRIC CURRENTS; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMISTRY; ELECTROLYTES; PHYSICAL VAPOR DEPOSITION; POLYETHYLENE GLYCOLS;

CAVITIES; CURRENT FLOW; ELECTROCHEMICAL MECHANICAL DEPOSITION (ECMD); PLANARIZATION;

ELECTRODEPOSITION;

EID: 10844269737     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1811591     Document Type: Article

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