메뉴 건너뛰기




Volumn 148, Issue 7, 2001, Pages

Electrochemical and Fill Studies of a Multicomponent Additive Package for Copper Deposition

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0001310173     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1376636     Document Type: Article
Times cited : (176)

References (19)
  • 3
    • 0442323047 scopus 로고    scopus 로고
    • U.S. Pat. 3,267,010 (1966)
    • H-G. Creutz, R. M. Stevenson, and E. A. Romanowski, U.S. Pat. 3,267,010 (1966); H-G. Creutz, R. M. Stevenson, and E. A. Romanowski, U.S. Pat. 3, 288, 690 (1966).
    • Creutz, H.-G.1    Stevenson, R.M.2    Romanowski, E.A.3
  • 4
    • 0442291641 scopus 로고    scopus 로고
    • U.S. Pat. 3, 288, 690 (1966)
    • H-G. Creutz, R. M. Stevenson, and E. A. Romanowski, U.S. Pat. 3,267,010 (1966); H-G. Creutz, R. M. Stevenson, and E. A. Romanowski, U.S. Pat. 3, 288, 690 (1966).
    • Creutz, H.-G.1    Stevenson, R.M.2    Romanowski, E.A.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.