Electrodeposition of Cu in the PEI-PEG-Cl-SPS additive system reduction of overfill bump formation during superfilling

Journal of the Electrochemical Society

Volumn 153, Issue 9, 2006, Pages

  Kim, S K ^a   Josell, D ^a   Moffat, T P ^a,b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEACTIVATING INTERACTION; ELECTROANALYTICAL MEASUREMENTS; HYSTERETIC VOLTAMMETRIC RESPONSES; METAL DEPOSITION REACTIONS;

ADAPTIVE SYSTEMS; ADSORPTION; AMINES; ELECTRODEPOSITION; POLYETHYLENE GLYCOLS; QUENCHING;

COPPER;

EID: 33750109890     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2216356     Document Type: Article

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