SCOPUS 정보 검색 플랫폼

Electrochemical and Solid-State Letters

Volumn 4, Issue 4, 2001, Pages

Superconformal electrodeposition of copper

(4) Moffat, T P a Wheeler, D a Huber, W H b Josell, D a

a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY (United States)

b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSTS; COMPUTER SIMULATION; COPPER; CYCLIC VOLTAMMETRY; ELECTROLYTES; INTERFACES (MATERIALS); MATHEMATICAL MODELS; NUMERICAL METHODS; REACTION KINETICS; SURFACE ROUGHNESS;

INTERFACE AREA; LOCAL GROWTH VELOCITY; METAL ELECTROLYTE INTERFACE; SUPERCONFORMAL ELECTRODEPOSITION;

ELECTRODEPOSITION;

EID: 0035323468 PISSN: 10990062 EISSN: None Source Type: Journal
DOI: 10.1149/1.1354496 Document Type: Article

Times cited : (325)

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