Microvia filling over self-assembly bisulfide molecule on Au and Cu seed layers a morphological study of copper deposits

Electrochemical and Solid-State Letters

Volumn 8, Issue 11, 2005, Pages

  Dow, Wei Ping ^a   Yen, Ming Yao ^a  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; COPPER DEPOSITS; ELECTRODEPOSITION; FILLING; PLATING; PRINTED CIRCUIT BOARDS; SULFUR COMPOUNDS;

BISULFIDE MOLECULES; METALLIC MATERIALS; MICROSTIWLURES; MICROVIA FILLING;

SELF ASSEMBLY;

EID: 27744508599     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2039957     Document Type: Article

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