Bath additive concentration effects on super-filling for copper damascene electroplating

Advanced Metallization Conference (AMC)

Volumn , Issue , 2000, Pages 181-186

  Frank, Aaron ^a   Jiang, Qt ^a   Chen, Linlin ^a   Carpenter, Brad ^a   Carpio, Ron ^a   Ritzdorf, Tom ^a   Pfeifer, Klaus ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ASPECT RATIO; COPPER PLATING; CYCLIC VOLTAMMETRY; PHYSICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY;

SUPER FILLING;

ELECTROPLATING;

EID: 0034460887     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)