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Volumn 147, Issue 1, 2000, Pages 227-232

Theory of filling of high-aspect ratio trenches and vias in presence of additives

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ASPECT RATIO; COMPUTER SIMULATION; COPPER; PROCESS ENGINEERING; RANDOM PROCESSES;

ADDITIVE-FREE BATH; HIGH-ASPECT RATIO TRENCHES;

ELECTROPLATING;

EID: 0033906753 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1393179 Document Type: Article

Times cited : (152)

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