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Journal of Applied Electrochemistry

Volumn 32, Issue 2, 2002, Pages 135-143

Unsteady diffusion effects on electrodeposition into a submicron trench

(3) Chalupa, R a Cao, Y a West, A C a

a Columbia University ^* (United States)

Author keywords

Copper electrodeposition simulation; Galvanostatic; Potentiostatic; Submicron features; Unsteady diffusion

Indexed keywords

BOUNDARY ELEMENT METHOD; CATHODES; COMPUTER SIMULATION; COPPER; CURRENT DENSITY; DIFFUSION; FINITE VOLUME METHOD; POSITIVE IONS; PROBLEM SOLVING; REACTION KINETICS;

DIFFUSION TIME; NONLINEAR REACTION RATE KINETICS; POTENTIOSTATIC PLATING; SUBMICRON TRENCH; TRENCH FILLING TIME; UNSTEADY DIFFUSION;

ELECTRODEPOSITION;

EID: 0036476933 PISSN: 0021891X EISSN: None Source Type: Journal
DOI: 10.1023/A:1014785927533 Document Type: Article

Times cited : (14)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.