Cationic surfactants for the control of overfill bumps in Cu superfilling

Journal of the Electrochemical Society

Volumn 153, Issue 12, 2006, Pages

  Kim, S K ^a,b   Josell, D ^a   Moffat, T P ^a,b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CETYLTRIMETHYLAMMONIUM CHLORIDE; DEACTIVATION; VOLTAMMETRIC HYSTERESIS;

ABSORPTION; COPPER; DEPOSITION; FILLING; HYSTERESIS; POSITIVE IONS;

SURFACE ACTIVE AGENTS;

EID: 33750795568     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2354456     Document Type: Article

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