Superconformal electrodeposition of copper in 500-90 nm features

Journal of the Electrochemical Society

Volumn 147, Issue 12, 2000, Pages 4524-4535

  Moffat, T P ^a   Bonevich, J E ^a   Huber, W H ^b   Stanishevsky, A ^c   Kelly, D R ^a   Stafford, G R ^a   Josell, D ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^c Bldg 142   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; BINARY MIXTURES; CHLORIDE MINERALS; COPPER; ELECTROLYTES; MICROSTRUCTURE; POLYETHYLENE GLYCOLS; RECRYSTALLIZATION (METALLURGY);

CUPRIC SULFATE ELECTROLYTES; DIFFERENTIAL CUPRIC ION CONCENTRATION;

ELECTRODEPOSITION;

EID: 0034514230     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1394096     Document Type: Article

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