Additive behavior during copper electrodeposition in solutions containing Cl-, PEG, and SPS

Journal of the Electrochemical Society

Volumn 150, Issue 6, 2003, Pages

  Tan, Min ^a   Harb, John N ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ADSORPTION; COPPER; DESORPTION; ELECTROPLATING; ELECTROPLATING SOLUTIONS; POLYETHYLENE GLYCOLS; SODIUM COMPOUNDS;

COPPER ELECTRODEPOSITION; GALVANOSTATIC CONDITION; POTENTIOSTATIC CONDITION; SODIUMSULFOPROPYL DISULFIDE;

ADDITIVES;

EID: 0038608146     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1570412     Document Type: Article

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