Mobility enhancement of strained Si transistors by transfer printing on plastic substrates

NPG Asia Materials

Volumn 8, Issue 3, 2016, Pages

  Lee, Wonho ^a   Hwangbo, Yun ^b   Kim, Jae Hyun ^b   Ahn, Jong Hyun ^a  

^a Yonsei University   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COST ENGINEERING; FLEXIBLE ELECTRONICS; INTERFACES (MATERIALS); SILICON; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; STRAINED SILICON; TENSILE STRAIN; THIN FILM TRANSISTORS;

EPITAXIAL DEPOSITION; MOBILITY ENHANCEMENT; PLASTIC SUBSTRATES; SILICON ON INSULATOR WAFERS; STRAIN ENGINEERING; STRAINED SI CHANNEL; TRANSFER PRINTING; TRANSFER TECHNIQUE;

SUBSTRATES;

EID: 84979642682     PISSN: 18844049     EISSN: 18844057     Source Type: Journal    
DOI: 10.1038/am.2016.31     Document Type: Article

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