Electrically conductive adhesives (ECAs)

Materials for Advanced Packaging

Volumn , Issue , 2009, Pages 365-405

  Lu, Daoqiang Daniel ^a   Wong, C P ^b  

^a Henkel Locitite China Corporation   (China)

^b Georgia Institute of Technology   (United States)

Author keywords

ACAs ACFs; Ball grid array (BGA); Chip scale package (CSP); Conductive particles; Conductivity; Contact resistance; Corrosion inhibitor; Electrically conductive adhesives (ECAs); Flip chip; ICAs; Impact performance; Lead free; Surface mount technology (SMT)

Indexed keywords

EID: 84890246115     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-0-387-78219-5_11     Document Type: Chapter

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