High frequency measurement of isotropically conductive adhesives

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1250-1254

  Liong, S ^a   Zhang, Z ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; ELECTRIC NETWORK ANALYZERS; ELECTRIC PROPERTIES; ELECTRON DEVICE MANUFACTURE; ELECTRON DEVICE TESTING; EPOXY RESINS; FLIP CHIP DEVICES; FREQUENCIES; SOLDERED JOINTS; SUBSTRATES; TIN COMPOUNDS;

FLIP-CHIP TEST VEHICLE; GOLD PLATE COPPER; ISOTROPICALLY CONDUCTIVE ADHESIVES; STENCIL PRINTING;

ELECTRONICS PACKAGING;

EID: 0034822517     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Conductive adhesives for electronics packaging
2. Electrical reliability of conductive adhesives for surface mount applications
3. Reliability of electrically conductive joint for surface mount applications: A summary of the state of art
4. Processing, structural and electrical properties of electrically conductive adhesives
5. Conductive adhesives for high-frequency applications
6. Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls
7. Conductive mechanisms of isotropic conductive adhesives
8. Mechanism underlying the unstable contact resistance of conductive adhesives
9. Conductive adhesives with improved properties
10. Full wave analysis and development of circuit models for flip-chip interconnects
11. Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications