Development of solderless joining technologies using conductive adhesives

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 11-15

  Takezawa, H ^a   Itagaki, M ^a   Mitani, T ^a   Bessho, Y ^a   Eda, K ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EUTECTICS; INTERFACES (MATERIALS); JOINING; SOLDERING ALLOYS;

CONDUCTIVE ADHESIVE; ELECTRICAL PERFORMANCE; JOINING TECHNIQUES; JOINING TECHNOLOGY; LIFETIME EXTENSION; PACKAGING STRUCTURE; TEMPERATURE CYCLING TESTS; TEMPERATURE HUMIDITY;

PACKAGING MATERIALS;

EID: 84892213647     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757279     Document Type: Conference Paper

References (1)

1. Satoshi Oike et al., IEMT/IMC Proceedings, pp 342 (1997)