Wire-to-wire bonding of μm-diameter aluminum wires for the Electric Solar Wind Sail

Microelectronic Engineering

Volumn 88, Issue 11, 2011, Pages 3267-3269

  Seppänen, Henri ^a   Kiprich, Sergiy ^b   Kurppa, Risto ^a,c   Janhunen, Pekka ^c   Hæggström, Edward ^a  

^a UNIVERSITY OF HELSINKI   (Finland)

^b KHARKOV INSTITUTE OF PHYSICS AND TECHNOLOGY   (Ukraine)

^c FINNISH METEOROLOGICAL INSTITUTE   (Finland)

Author keywords

Electric Solar Wind Sail; Wire bonding; Wire to wire

Indexed keywords

ALUMINUM WIRES; BONDING METHODS; ELECTRIC SOLAR WIND SAIL; METAL WIRES; PULL FORCE; UNIT PROCESS; WIRE BONDING; WIRE-TO-WIRE; WIREBONDER;

BONDING; ELECTRONICS PACKAGING; JIGS; SOLAR WIND; SPACE TETHERS; TETHERLINES;

WIRE;

EID: 80053341378     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2011.07.002     Document Type: Article

References (5)

1. P. Janhunen J. Propul. Power 20 763 2004
2. P. Janhunen Ann. Geophys. 27 2009 3089 3100
3. P. Robert, Hoyt L. Robert, Forward U.S. Patent No. 6286788, 2001.
4. George Harman Wire Bonding in Microelectronics: Materials Processes Reliability and Yield second ed. 1997 McGraw-Hill Professional
5. K. Shankara Prasad Advanced Wirebond Interconnection Technology first ed. 2004 Springer