Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging

Journal of Materials Science

Volumn 42, Issue 2, 2007, Pages 615-623

  Murali, S ^a   Srikanth, N ^a   Wong, Y M ^a   Vath III, Charles J ^a  

^a ASM Technology Singapore Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; MICROELECTRONICS; PLASTIC DEFORMATION; THIN FILMS;

ELECTRICAL INTERCONNECTIONS; OXIDE FILMS; SOLID SOLUBILITY; THERMOSONIC COPPER WIRE BONDING;

COPPER METALLURGY;

EID: 33846786811     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-006-1148-7     Document Type: Article

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