High aspect ratio PMMA posts and characterization method for micro coils manufactured with an automatic wire bonder

Sensors and Actuators, A: Physical

Volumn 156, Issue 2, 2009, Pages 328-333

  Kratt, Kai ^a   Badilita, Vlad ^a   Burger, Tobias ^a   Mohr, Jürgen ^b   Börner, Martin ^b   Korvink, Jan G ^a   Wallrabe, Ulrike ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

3 D micro coil; Deep X ray lithography; Wire bonding

Indexed keywords

CHARACTERIZATION METHODS; DEEP X-RAY LITHOGRAPHY; ELECTRICAL MEASUREMENT; FULLY COMPATIBLE; HIGH ASPECT RATIO; MEMS PROCESS; MICROCOILS; OUTER DIAMETERS; QUALITY FACTORS; SHEAR TESTS; SINGLE LAYER; SUPPORT STRUCTURES; WINDING NUMBER; WINDING PROCESS; WIRE BONDING; WIREBONDER;

BONDING; LITHOGRAPHY; PHOTORESISTS; PRESSURE DROP; THREE DIMENSIONAL; TRANSFORMER WINDINGS; WINDING; WIRE; X RAY LITHOGRAPHY;

ASPECT RATIO;

EID: 71649097125     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.10.010     Document Type: Article

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