Erratum to "Iterative optimization of tail breaking force of 1 mil wire thermosonic ball bonding processes and the influence of plasma cleaning". [Microelectron. J. 38 (2007) 842-847] (DOI:10.1016/j.mejo.2007.07.095);Iterative optimization of tail breaking force of 1 mil wire thermosonic ball bonding processes and the influence of plasma cleaning

Microelectronics Journal

Volumn 38, Issue 8-9, 2007, Pages 842-847

  Lee, J ^a   Mayer, M ^a   Zhou, Y ^a   Hong, S J ^b  

^a UNIVERSITY OF WATERLOO   (Canada)

^b MK Electron Co Ltd   (South Korea)

Author keywords

Leadframe; Tail breaking force; Tensile test; Thermosonic; Wire bonding

Indexed keywords

COPPER; FORCE MEASUREMENT; METALLIZING; ONLINE SYSTEMS; OPTIMIZATION; PROXIMITY SENSORS; TENSILE TESTING;

LEADFRAME; TAIL BREAKING FORCE; THERMOSONIC; WIRE BONDING;

PLASMAS;

EID: 34848865650     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2007.10.015     Document Type: Erratum

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