Solenoidal micro coils manufactured with a wire bonder

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 996-999

  Kratt, Kai ^a   Seidel, Marit ^b   Emmenegger, Markus ^c   Wallrabe, Ulrike ^a   Korvink, Jan G ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b Oerlikon Assembly Equipment AG   (Switzerland)

^c Stoecklin Software AG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; ELECTRIC WIRE; MANUFACTURE; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; REACTIVE ION ETCHING; SOLENOIDS; TRANSFORMER WINDINGS; WIRE;

A-STABLE; BOND PROCESSES; INTERNATIONAL CONFERENCES; MANUFACTURING TECHNOLOGIES; MICRO COILS; MICRO-ELECTRO MECHANICAL SYSTEMS; QUALITY FACTOR; SUB-MILLIMETER; WINDING PROCESSES; WIRE BONDERS;

WINDING;

EID: 50149111572     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443826     Document Type: Conference Paper

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