Linkage-spring model in analyzing wirebonding loops

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 3, 2001, Pages 450-456

  Lo, Yu Lung ^b   Ho, Tien Lou ^b   Chen, Jau Liang ^a,c   Lee, Rong Shean ^b   Chen, Tei Chen ^b  

^a IEEE

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Bond loop; Elastic plastic large deformation; Wire profile; Wire recrystallization; Wire bonding

Indexed keywords

BONDING; COMPUTER SIMULATION; DEGREES OF FREEDOM (MECHANICS); FINITE ELEMENT METHOD; PLASTIC DEFORMATION; STATISTICAL METHODS; STRESS ANALYSIS;

BOND LOOP; ELASTIC-PLASTIC LARGE DEFORMATION; LOOP SAGGING; NECKING; WIREBONDING;

ELECTRIC WIRE;

EID: 0035439621     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.946493     Document Type: Article

References (9)

1. Crossing the 200 wire barrier in VLSI bonding
2. Wire bond loop profile development for fine pitch-long wire assembly
3. Metallurgical behavior of gold wire in thermal compression bonding
4. Wire bonding strategies to meet thin packaging requirements - Part I
5. Design in triangle-profiles and T-profiles of a wirebond using a linkage-spring model
6. Method of wire bonding
7. Method of making constant clearance flat link fine wire interconnections